SPECIAL SESSION

Special Session 3: Advanced Microwave and Millimeter-Wave Circuit Designs for Next-Generation Wireless and Sensing Systems

RF Module always play critical roles in the modern wireless communication. Recently, few advanced design and package technologies have been proposed in an attempt to break through the limitation of Moor Law in semiconductor applications. This special session aims to highlight recent advances in the design and application of Antenna on-Chip (AoC), System-on-Chips (SoCs), and 3D IC, particularly in the microwave, millimeter-wave, and even terahertz frequency bands. We invite papers that explore these topics across various domains, with a focus on both theoretical developments and practical implementations.

The novelty of this special session lies in its holistic focus on cross-domain integration—bridging circuit design, electromagnetic theory, and semiconductor packaging—to enable next-generation RF and millimeter-wave systems. By bringing together experts from both academia and industry, this session provides a platform to discuss innovative design methodologies, emerging materials, and fabrication processes that push the boundaries of performance, size, and cost in microwave, millimeter-wave, and terahertz applications. The session emphasizes both theoretical advancements and practical implementations, highlighting how multi-disciplinary approaches can pave the way toward highly integrated, scalable, and low-cost RF front-end systems for future 6G and beyond communication technologies.

Related topics: （此专题涉及的征稿主题）

  1. Microwave and Millimeter-Wave Components and Circuits
  2. Advanced Semiconductor Packaging
  3. Antennas and Electromagnetic Wave Propagation
  4. Antennas and Electromagnetic Wave Propagation

    5. Submit Method:
    1, Submit it via the link: http://confsys.iconf.org/submission/icece2025 (after entering the link, click on the corresponding topic)
    2, Send your manuscript to icece_conf@vip.163.com with subject "Submit+Special Session-3+Paper Title". (请通过邮件发送稿件，邮件题目：Submit+Special Session-3+Paper Title)
    3, Submission deadline: September 25, 2025

    Dr. Yiqun Liu, Xi’an University of Technology, China

    Yiqun Liu (Ph.D.) is a Lecturer with the School of Automation and Information Engineering, Xi’an University of Technology, China. His research interests include millimeter-wave active/passive circuits and 3D advanced integration and packaging design. Over the past five years, he has published more than 20 papers in prestigious journals and conferences in the field of microwave and integrated circuits, including IEEE Transactions on Microwave Theory and Techniques and IEEE Transactions on Circuits and Systems II: Express Briefs. He has presided over or participated in several research projects funded by the National Natural Science Foundation of China (NSFC), the Joint Fund of NSFC, and the Natural Science Foundation of Shaanxi Province of China.

     

    Asst. Prof. Jianfeng Yang, Xi’an University of Architecture and Technology, China

    Jianfeng Yang (Ph.D.) is an Assistant Professor with the School of Electronics and Information Engineering, Xi’an University of Architecture and Technology, China.  His research interests include electromagnetic metasurface theory and design, as well as electromagnetic measurement. He has published several papers as the first or corresponding author in journals of Optics Express and Journal of Physics D: Applied Physics. He has presided over or participated the National Key R&D Program of China, National Natural Science Foundation of China (NSFC), the Natural Science Foundation of Shaanxi Province of China, and defense-related industrial projects.